LV-Webinar: „Bionic Structures for Heat Exchangers“
Bionic Structures for Heat Exchangers
By PM Inventions & Lauterbach Verfahrenstechnik
Take Heat Exchange to the Next Level
Create highly efficient 3D-printable heat management structures using advanced generative algorithms. From microscopic coolers to industrial condensers – bionic structures scale naturally with your challenge.
What We Offer
Using mathematical optimization and CAD automation, we generate structures that maximize thermal dissipation and surface interaction. You define the space and energy zones – we deliver a ready-to-print solution optimized for your specific application.
Use Cases & Applications
Cooling Components
Ultra-compact thermal structures embedded into electronic substrates to manage heat in tight spaces. Our bionic cooling designs are tailored for microelectronics, sensor arrays, and densely packed PCBs. By combining minimal form factors with maximized heat dissipation, they ensure thermal reliability in performance-critical environments – whether in IoT devices, wearables, or aerospace applications. Designs are fully integratable and can be 3D-printed directly onto or into housings and enclosures.
Industrial Condensers
Scalable structures for chemical engineering applications, maximizing condensation efficiency and flow control. Our bionic geometries enable large-scale heat exchange with minimal pressure loss, optimized for continuous operation under demanding conditions. Suitable for refinery condensers, distillation columns, and gas-liquid separation systems, each design is simulated for phase change dynamics and tailored to your process constraints. Integration into existing piping systems is also supported.
Integrated Thermal Management
3D-printed components with embedded cooling paths. These solutions are ideal for compact mechatronic systems and hybrid assemblies. By merging structure and function, we eliminate the need for external coolers or mounts. Whether air- or liquid-based, our designs ensure efficient temperature regulation from within – suited for electric drives, laser modules, and medical devices.
Industrial Watercooling
Modular, scalable, and engineered for high-throughput applications: our watercooling systems combine bionic channel design with robust industrial integration. Whether for power electronics, battery systems, or process components – we tailor the structure to your flow rates, temperature targets, and pressure constraints.
Lauterbach Verfahrenstechnik GmbH inf@lv-soft.de www.lv-soft.de
Your partner for engineering calculations, consulting, and training — in accordance with the ASME Code
